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          芯片封裝專家

          收藏職位
          • 我要分享
          • 50萬-80萬/年
          • 上海
          • |
          • 5年以上
          • |
          • 本科
          • |
          • 全職

          職位誘惑: 年終獎金,五險一金,福利好,年底雙薪,成長空間大,技術領先,節日禮物,技能培訓

          發布時間: 2023-11-23發布

          職位描述

          As a package designer, you will be responsible for advanced package design and technology development, as well as foundry management and vendor interfacing.
          You responsibilities include, but not limited to:
          • Design rule development and implementation of in-house packaging layout to meet product requirements.
          • EDA tool set up and flow development.

          • PI/SI analysis on full chip and critical IPs at package and board level.
          • Define and develop package solution for high speed, high power and large pin count device in a cross-function team
          • Collaborate with foundry, PE, TE and QA teams on chip bring up and qualification.
          • Interface with vendors on process optimization, chip characterization and failure analysis for volume production
          • Drive new technology development such as multi-die, hybrid-bonding, advanced substrate, design for manufacturability and design for reliability, as a collaborative effort with vendors
          職位要求
          • Master’s degree and/or PhD in Electrical Engineering or related fields with 5+ years of experience.
          • Hands on experiences the following: Cadence Allegro APD & SiP tools, Sigrity XtractIM, PowerSI
          • Hands on experiences with layout of FCBGA, MCM, SiP, WLBGA etc and optimization for ball count and power grid.
          • Experience on design of very large form factor flip chip package with high substrate layer count
          • Experience on 2.5D or 3D multi-die solutions such as Info, CoWoS, SoIC or chiplet.
          • Experience with high-speed IO interfaces design and bringup such as DDR, PCIe and HBM is preferred.
          • Experience on mechanical and thermal analysis and control, knowledge on mechanical and thermal reliability is a must.
          • Understanding of voltage regulator design and power distribution is a plus.
          • Capability of driving package roadmap to meet future products on advanced nodes.

          職位發布者

          IVY

          HR

          7天

          簡歷處理用時

          100%

          簡歷及時處理率

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          上海瑾訊微信息技術有限公司

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          領域: 智能硬件,通信網絡,汽車電子

          規模: 0-50人

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          工作地址:

          浦東新區川和路55弄張江人工智能島

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